H-Etchbond 5th generation bond 5ml

H-Etchbond (H-BOND) is a 5th-generation light-curing Prime/Bond adhesive from Heydent (Germany) that creates a strong bond between composite materials and both dentin and enamel. When combined with the H-BOND Activator, it converts into a chemically or dual-curing system suitable for root canal applications, and it can also be used with chemically and dual-hardening materials.

Clinical Uses

• Bonding light-cured composite restorations to dentin and enamel
• Dual-cure or chemical-cure bonding when paired with H-BOND Activator, including root canal/post-space applications
• Bonding with chemically or dual-hardening core build-up and cement materials

Key Features

• 5th-generation Prime/Bond system for a strong, reliable bond to dentin and enamel
• Light-curing by default, with the flexibility to become chemical/dual-cure via H-BOND Activator
• Compatible with chemically and dual-hardening materials for broader clinical use beyond direct composite
• Made for use with the full HEYTEC composite range from the same manufacturer

Specifications

Why Buy From MedSTA

• Genuine Heydent stock through an official distributor, not unverifiable gray-market imports
• Matched bonding agent for the full HEYTEC composite line, including HEYTEC-NC, HEYTEC-MR, and HEYTEC Universal
• Browse the full Composite collection for the rest of the HEYTEC system
• Fast delivery across Egypt with support from a dental-specialist team

FAQ

Do I need the H-BOND Activator to use this product?
No, H-Etchbond works as a standalone light-curing adhesive for standard composite restorations. The Activator is only needed when you require a chemical or dual-curing bond, such as for root canal/post-space applications.

Can H-Etchbond be used with composite brands other than HEYTEC?
It's formulated to bond composite materials to dentin and enamel generally, so it's compatible with light-cured composite systems beyond the HEYTEC range, though it's specifically matched to HEYTEC's handling characteristics.

Is H-Etchbond suitable for indirect restorations?
When combined with the H-BOND Activator for dual/chemical curing, it can support indirect and post-space bonding where light alone can't fully cure the adhesive.