Vincismile Flipro bond 6 ml

Vincismile HugeBond Universal FliPro is an advanced 8th-generation self-etch dental adhesive designed for exceptional bonding strength and versatility. Featuring a user-friendly flip-open cap, it ensures easy, one-handed operation. This adhesive is compatible with total-etch, self-etch, and selective-etch techniques, making it ideal for both direct and indirect restorations. With a low film thickness of just 3μm and ultra-mild pH (2.7), it provides strong adhesion to various substrates, including enamel, dentin, metal, ceramic, zirconia, and composite materials. The formulation includes MDP monomer to enhance bonding strength and effectively seal dentin tubules, ensuring long-lasting results and reduced post-operative sensitivity.

Advantages:

• Impressive Universality: Suitable for various surfaces including enamel, dentin, composite resin, metal, and oxide full-ceramic (zirconia, alumina).
• Cement Compatibility: Works with light-cured, self-cured, and dual-cured cements.
• Multiple Etch Techniques: Compatible with self-etch, total-etch, and selective-etch techniques.
• Bonding Strength: Provides a bonding strength of over 20 MPa to tooth surfaces.
• Strong Permeability: Easily penetrates dentin tubules to form a strong bond upon curing.
• Low Film Thickness: No thicker than 3μm, ensuring minimal interference with restorations.
• Reduced Microleakage: Prevents secondary caries and minimizes post-operative sensitivity.
• User-Friendly Design: Flip-open cap for easier one-handed application and an innovative dispensing system that reduces waste.
• Larger Capacity: Reduces inventory pressure and cost by offering a larger bottle size.

Indications:

• Direct bonding of restorations made of metal, ceramic, zirconia, composite, and other materials.
• Cementation of orthodontic bands.
• Direct bonding under light-cured composite resin or compomer fillings.
• Repair of dental restorations made from ceramic, composites, or metal alloys, using light-cured composite resin.
• Use with resin cement for various bonding applications.